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PCB Manufacturing

PCB Manufacturing

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We can turn out various PCB plates and offer quick manufacturing of sample of customer and PCB in small and medium
batch.

 

Plate Making Ability
 


 

Technological Parameters of Plate Making

 
 Maximum Level:40;

 

 Minimum Line Width/Line Distance:3mil/3mil
 
 Maximum Copper Thickness:10 OZ
 
 Minimum Bore Diameter:Machine Drilling4mil  Laser Drilling: 3mil
 
 Maximum Ratio of Thickness to Radial Dimension:18:1
 
 Impedance Control Tolerance:±5%
 
 Appearance Tolerance:±0.1mm
 
 Material:FR4, high Tg, halogen-free, ceramic filling, PI, BT, PPO, PPE, PTFE, high-frequency /
 microwave (Rogers, Taconic, Arlon, F4B), metal matrix / core (aluminum, copper, iron),
 metal based/core;
 
 Surface Treatment: HASL, OSP, gold plating, immersion gold, heavy silver, heavy tin;
 
 Special Processing:combination of rigidity and bending, burial of magnetic core, burial of optical
 fiber, burial of capacitance / resistance, third-order pile hole folded hole HDI, pore plate, inner /
 outer hollow plate, high TG thick copper, mixed pressure, local mixed pressure, multiple surface
 coating, metal base plate / core plate, edge metallization, buried hole, blind hole, steps slot,
 local high density, back drill, impedance control,etc.