中文  |  EN 

About

>
PCBA Processing

PCBA Processing

Page view:

We employ complete process from SMT paster to the welding and pressure welding of DIP.

SMT is equipped with brand-new imported Samsung high-speed chip mounter, automatic printing machine, reflow soldering, AOI, and SPI optical online detection equipment as well as glue dispenser, X-Ray, and BGA sealing-off machine. SMT’s
monthly capacity of paster totals 26.2 million points.

DIP has an assembly line involving plug-in, wave soldering, and backhand welding and is able to carry out single-board test and a daily processing capacity of 1000PCS.


Processing Capacity

 


PCBA Processing

  

  Process Capability


  Specification of Mounted Component:

    Minimum Precision:0201  

    Minimum Spacing:BGA 0.4 Pitch                    

          IC 0.3 Pitch

  Specification of Plate    

    Maximum Dimension: 460 ╳ 510mm    

    Width:0.3~6mm    

    Type:Hard board, Soft board, Rigid-flex board, FPC and POP

  Welding Type: lead-free; with lead;

  Mounting Technology: POP, bonding,automatic plug-in; Detectability:online solder paste
  testing equipment (SPI), automatic optic inspection (AOI), X-ray detection, aging function
  test, thermocycling, etc.