We employ complete process from SMT paster to the welding and pressure welding of DIP.
SMT is equipped with brand-new imported Samsung high-speed chip mounter, automatic printing machine, reflow soldering, AOI, and SPI optical online detection equipment as well as glue dispenser, X-Ray, and BGA sealing-off machine. SMT’s
monthly capacity of paster totals 26.2 million points.
DIP has an assembly line involving plug-in, wave soldering, and backhand welding and is able to carry out single-board test and a daily processing capacity of 1000PCS.
Minimum Spacing:BGA 0.4 Pitch
IC 0.3 Pitch
Specification of Plate
Maximum Dimension: 460 ╳ 510mm
Type:Hard board, Soft board, Rigid-flex board, FPC and POP
Welding Type: lead-free; with lead;
Mounting Technology: POP, bonding，automatic plug-in; Detectability:online solder paste